advanced power n-channel enhancement mode electronics corp. power mosfet simple drive requirement bv dss 80v lower on-resistance r ds(on) 13m ? fast switching characteristic i d 75a halogen free & rohs compliant product description absolute maximum ratings symbol units v ds v v gs v i d @t c =25 a i d @t c =100 a i dm a p d @t c =25 w w/ e as single pulse avalanche energy 3 mj i ar avalanche current a t stg t j symbol value units rthj-c maximum thermal resistance, junction-case 0.9 /w rthj-a 40 /w rthj-a maximum thermal resistance, junction-ambient 62 /w data and specifications subject to change without notice thermal data parameter storage temperature range total power dissipation 138 -55 to 150 operating junction temperature range -55 to 150 linear derating factor 1.11 continuous drain current, v gs @ 10v 48 pulsed drain current 1 260 450 30 parameter rating drain-source voltage 80 gate-source voltage + 20 continuous drain current, v gs @ 10v 75 a p85t08gs/p-hf halogen-free product 201204033 maximum thermal resistance, junction-ambient (pcb mount) 4 1 g d s a dvanced power mosfets from apec provide the designer with the best combination of fast switching, ruggedized device design, low on- resistance and cost-effectiveness. the to-263 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. the through-hole version (ap85t08gp) are available for low-profile applications. g d s to-263(s) g d s to-220(p)
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =250ua 80 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =45a - - 13 m ? v gs(th) gate threshold voltage v ds =v gs , i d =250ua 1 - 3 v g fs forward transconductance v ds =10v, i d =45a - 70 - s i dss drain-source leakage current v ds =80v, v gs =0v - - 10 ua drain-source leakage current (t j =125 o c) v ds =64v ,v gs =0v - - 100 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =45a - 63 100 nc q gs gate-source charge v ds =64v - 23 - nc q gd gate-drain ("miller") charge v gs =4.5v - 38 - nc t d(on) turn-on delay time v ds =40v - 30 - ns t r rise time i d =45a - 100 - ns t d(off) turn-off delay time r g =10 ? - 144 - ns t f fall time v gs =10v - 173 - ns c iss input capacitance v gs =0v - 6300 10080 pf c oss output capacitance v ds =25v - 670 - pf c rss reverse transfer capacitance f=1.0mhz - 350 - pf r g gate resistance f=1.0mhz - 1.1 1.7 ? source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =45a, v gs =0v - - 1.3 v t rr reverse recovery time i s =20a, v gs =0v - 47 - ns q rr reverse recovery charge di/dt=100a/s - 86 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test 3.starting t j =25 o c , v dd =30v , l=1mh , r g =25 ? , i as =30a. 4.surface mounted on 1 in 2 copper pad of fr4 board this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. ap85t08gs/p-hf 2
a p85t08gs/p-h f fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 50 100 150 200 250 036912 v ds , drain-to-source voltage (v) i d , drain current (a) t c =25 o c v g =3.0v 10v 7.0 v 5.0v 4.5v 0 30 60 90 120 036912 v ds , drain-to-source voltage (v) i d , drain current (a) t c = 150 o c v g =3.0v 10v 7.0 v 5.0v 4.5v 10 11 12 13 14 246810 v gs gate-to-source voltage (v) r ds(on) (m ) i d =20a t c =25 o c 0.4 0.8 1.2 1.6 2.0 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =45a v g =10v 0 10 20 30 40 50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th)
ap85t08gs/p-h f fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. transfer characteristics fig 12. gate charge waveform 4 q v g 4.5v q gs q gd q g charge 100 1000 10000 1 5 9 1317212529 v ds ,drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse 1 10 100 1000 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) i d (a) t c =25 o c s in g le puls e 100us 1ms 10ms 100ms dc 0 40 80 120 02468 v gs , gate-to-source voltage (v) i d , drain current (a) t j =150 o c t j =25 o c v ds =5v 0 2 4 6 8 10 0 20406080100 q g , total gate charge (nc) v gs , gate to source voltage (v) v ds =40v v ds =50v v ds =64v i d =45a operation in this area limited by r ds(on)
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